“Data Center Challenges: Powering ‘The AI Factories’”

As the GPU (TPU) computation cost plummeted by almost 100%, AI continues its marching from generative to agentic. In the meantime, the demand for power is skyrocketing. Recent projections by Microsoft/Google/Meta forecast the power per rack is going from current 100kW to future 1MW. And the overall power demand for “AI factories” worldwide is doubling to be 1,000 TWh annually by 2030, as predicted by Delloitte. The ever-increasing power demand poses unprecedented challenges for the power, electronics, and computing industries. A brief history for powering computing industry is first recapped, followed by current challenges in power, thermal management, networking and workforce development. The power system architecture options are then presented and key features for future architecture are discussed. Flexible electronic Large Power Transformers (FeLPTs) are emerging as a critical technology node. Key FeLPTs circuit options are discussed. Challenges in interfacing with power grids are detailed. Structured microgrids are natural candidates for efficient and effective data center power and energy management. Desired features for architecting the UPS systems, together with its required storage capacity, are then presented. In-rack and off-board power processing solutions are then proposed. Challenges in on-board power processing are elaborated, together with desired enabling characteristics for future sub-volt designs.

Dr. Tan is a member of the National Academy of Engineering, a fellow of the IEEE and a PhD from Caltech. He has served as Distinguished Engineer, Fellow, Chief Engineer-Power Conversion, Program Manager, Senior Department Manager, and Center Director in a leading US Fortune 500 corporation. Unusually prolific as a visionary and impactful leader in ultra-efficient power conversion and electronic energy systems, Dr. Tan has pioneered breakthrough innovations with numerous high-impact industry firsts and record performances that received commendations from the highest level of US Government. He has developed hundreds of designs and thousands of hardware units deployed for space systems without a single on-orbit failure. His suite of world-class electronics performed flawlessly on the James Webb Space Telescope (JWST) one million miles away with world-record-breaking on-orbit performances, advancing humanity’s deep space understanding for years to come.

Dr. Tan is the IEEE Technical Activities Vice President, 2026. He has served as founding President of IEEE Transportation Electrification Council, Chair of IEEE Fellow Advisory/Oversight Subcommittee, Vice Chair of IEEE Industry Engagement Committee, Division II Director, IEEE Board of Directors, Fellow Committee Chair, IEEE PELS/PES eGrid Steering Committee Chair, PELS Long Range Planning Committee Chair, Nomination Committee Chair, PELS President, founding Editor-in-Chief for IEEE Journal of Emerging and Selected Topics in Power Electronics, APEC (the fourth largest event in IEEE) General Chair, PELS Vice President-Operations, Guest Editor-in-Chief for IEEE Transactions on Power Electronics and IEEE Transactions on Industry Applications, Fellow Committee, PELS Vice President-Meetings, IEEE Chair for IEEE/Google Little Box Challenge (awarded $1M cash prize), and IEEE/DoD Working Group Chair, developed IEEE/ANSI standards 1515/1573. Don has delivered about 140+ keynotes/invited global presentations. He has received more than $30M external customer funding for research and technology development. He also serves on many prestigious national/international awards and review committees.